Tyndall’s Photonics Packaging Group partners with MIT on chip development... 01?May?2024 ...and Ohio State and Tyndall collaborate on research into visible light-wave generation. Prof. O’Brien lecturing on advanced packaging at MIT in January 2024. Researchers at Tyndall National Institute , Cork, Ireland, led by Prof. Peter O’Brien, have been awarded funding by the National Science Foundation in the U.S. to diversify and strengthen the supply chain for manufacturing and packaging of semiconduct...